- Development and modification
- Prototyping and manufacturing
- Testing and verification
Development and modification
Specific customer development of micro-systems
as well as packaging solutions by applying long term experience in semiconductor industry
including Optical & Electrical design and Temperature verification.
Prototyping and manufacturing
Cost effective, high precision wafer level assembly methods.
Encapsulation of the micro-modules in hermetically tight packages.
Micro-assembly of encapsulated components to more complex subunits with high precision alignment and mounting with laser welding.
Providing of single manufacturing processes as a part of customer's external manufacturing chain.
Testing and verification
Complete optical and electrical characterization.
Flexible to modify standard testing methods to satisfy specific requirements.
Planning and realizaton of various tests for product qualification.