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WA Level - DICING
- Sawing of various substrate materials (e.g.: silicon, glass, ceramics)
- Specialized in sawing of fully assembled and wire bonded wafers
- Integrated cleaning process for reduced operator interaction
- Wafer handler for batch processing
- Single and double spindle systems for mixed material processing
- Automated cut control
- position of cut
- quality of edge
- Various cut forms (e.g.: step-cut, bevel-cut, multi-index, multi-channel dicing)
- Integrated vision recognition system and blade exposure and damage control
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