Solutions
R&D competence
Development
- Customer specific development of micro-systems as well as packaging solutions for volume production by applying wafer-based production technology from semiconductor industry
Prototyping
- Prototyping can be performed on the equipment for volume production. Therefore there is no need for a technology transfer at the end of the development phase
Manufacturing
- Cost effective, high precision micro-assembly of chips and micro-modules with wafer based assembly methods for volume manufacturing
- Encapsulation of the micro-modules in hermetic tight packages in volume production
- Assembly of encapsulated components to more complex subunits with high precision alignment and mounting with laser welding
- Application of single manufacturing processes as part of an external manufacturing chain of the customer
Characterization
- Execution of cost effective measurement and characterization of micro-assemblies using the on-wafer probing of electrical, optical and mechanical properties
Burn-In
- Execution of cost effective Burn-In and aging tests with chip components and micro-assemblies on wafer scale
