Highly sophisticated packaging technologies and services
Wafer level packaging
TO Diode packaging (TO-CAN)
OSA packaging (TOSA/ROSA)
BIDI sub-assembly
Transceiver assembly
Services
R&D
Transfer & Production Ramp up
Custom packaging
Products
Micromodules
TO-Diodes
Bi-directional optical modules (BIDIs)
Prototypes and samples
High-volume series production
EZconn, your specialist on
News
EZconn provides a packaging service for different kind of chips into TO package and OSA (TOSA, ROSA), or into special custom packaging.
Our manufacturing facility has been granted approval for operation 24 hours a day, 7 days a week.
EZconn Europe – an European contract manufacturer offers its customer a full range of service in development and manufacturing of micro electronic microsystems (MEMS), wafer level service and packaging service as well as special custom packaging of semiconductor devices for a variety of applications.
About us
EZconn Europe GmbH was founded in June 2005 as a subsidiary of EZconn Corporation.
From September 2006 our company has been part of international company eGtran, when EZconn and GTRAN combined to become a world leading designer and supplier of high-performance broadband connectivity products.
The basis of the business is a highly sophisticated production line from Infineon Fiber Optics GmbH which was acquired by EZconn Corp (Taiwan).
We have also product development, marketing and sales and manufacturing facility in the Czech Republic.